Part Name	Material	quality	Remark
	Butto n	PA+30%GF	1	Black
	Spring	C2680R	1	Silver Plating
	Contact	Silver alloy	3
	Change Plate	C5210R	1	Silver Plating
	Base	PA+30%GF	1	Black
	Terminal	C2680R	1	Silver Plating
	Cover	PA+30%GF	1	Black
	Fixed Rod	C2680R	1

Hand soldering :
Use a soldering iron of 30 watts, Controlled at 380 ℃ approximately 3 seconds while solder applying.
Wave soldering:
When applying wave soldering, the peak temperature of the wave oven should be set to 260 ℃ max. Condition for soldering (wave & Non-washable Type) Temperature Profile

Tems	Conditions
Preheating temperature	Ambient temperature of the soldered surface of PC board.100 ℃ max.
Preheating time	60s max.
Peak temperature	260°C max
Continuous dipping time	5 sec max
Number of soldering	2 time max

Reflow soldering:
When applying reflow soldering, the peak temperature of the reflow Oven should be set to 250 ℃ max . Condition for soldering (Reflow & Non-washable Type) Temperature Profile:

Conditions A Temp. rise gradient 1 - 5°C/sec B Heating time 60 - 120sec Heating temperature 120 - 220°C C Temp. rise gradient 1 - 5°C/sec D Time over 230°C 90sec E Peak temperature 260°C Peak-temp. hold time Momentary Soldering 1 times

Note: Temperatures and time for A through E in the table above shall be measured on the top surface of the component.